RMPCT5500 3D planar CT (inline 3D-AXI)

Availability:In stock

SKU

LBX-RYM-0010

The Royma RMPCT5500 inline 3D-AXI system combines DR imaging and planar CT for automated PCB inspection with 300+ CT slices per scan. It detects cold solder joints, BGA defects, back-drilled stub depth, and residual copper with AI-powered analysis and MES integration — full-traceability non-destructive testing for multi-layer PCBs and IGBT substrates.

BrandRoyma Tech

More Information
Product Name	RMPCT5500 3D planar CT (inline 3D-AXI)
Weight	1.000000
Part No.	LBX-RYM-0010
Supplier Item Code	ARMPCT5500

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Details

Technical Data
Dimensions (L×W×H)	1500×2200×1800mm
Weight	≈3t
Max Sample Size (L×W×H)	600×660mm Substrate thickness 1–5mm
Max Sample Weight	2.5kg (5kg optional)
2D Resolution (μm)	3~30
3D Resolution (μm)	3~30
Suitable Workpieces	Multi-layer PCBs, backplanes, IGBT substrates, packaging; consumer electronics, semiconductor
Scan Mode	DR imaging Planar CT imaging CT projection angle: 30°, 45° 1–512 projections Inline and offline operation
Mechanical Axes	X-ray source: X, Y, Z axes Detector: X, Y axes
Tube Voltage	40–130kV Tube current: 10–300μA Max. target power: 39W
Detector Type	Flat panel detector 14-bit A/D conversion Max. frame rate: 15fps
Pixel Matrix	2304×2940
Imaging Area	Max. FOV: 57×73mm
Greyscale	14bits 16,384 grey levels
Operating Environment	Supply voltage: 220V, 50/60Hz
Radiation Safety (Leakage)	Leakage ≤1μSv/h
Model Features	Inline 3D-AXI with automatic defect identification >300 CT slices, non-destructive Synchronous AOI inspection AI measurement of back-drilled stub depth and residual copper MES integration, full traceability
Typical Defects Detected	Cold solder joints Abnormal solder wetting Short circuits Excess / insufficient solder Inadequate fill Component misalignment Solder ball shift Foreign matter, bubbles Presence / absence of pins Back-drilled stub depth, residual copper, hole eccentricity, layer spacing
Typical Applications	Multi-layer PCBs, backplanes, IGBT substrates; consumer electronics; semiconductor packaging; new energy; aerospace; casting; automotive